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A representation of the solder paste printing process that is a part of creating a Printed Circuit Board Assembly (PCBA).

Printed Circuit Board Assembly (PCBA)

The THORS Printed Circuit Board Assembly (PCBA) course is designed to provide learners with an overview of PCBA processes, covering everything from incoming inspection of the board to final testing of the finished product. Ready to take the next step? Explore the course details and see everything we’ve packed into this program!

Learning Hours: 2

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Course Description

The THORS Printed Circuit Board Assembly (PCBA)course introduces learners to the PCBA process, beginning with incoming inspection and laser marking. The course covers common assembly processes such as solder paste printing, component placement, and reflow soldering. Additional processes, including In-Circuit Testing (ICT), depaneling, functional testing, enclosure assembly, and final testing, support complete product realization. Presented in THORS’ highly visual and interactive learning format, this course will equip learners to broaden their knowledge of PCBA and its related technologies.

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Who will benefit from this Printed Circuit Board Assembly (PCBA) course?

Quality, manufacturing, engineering, design, testing, purchasing, and sales functions at organizations that require an understanding of the PCBA processes and product realization.

Course Classification

This manufacturing course by THORS eLearning Solutions covers identification of key terms, understanding of key concepts, and application of the covered topics.

*THORS uses the Bloom’s Taxonomy Methodology for our course development.

Certificate Awarded for Printed Circuit Board Assembly (PCBA)

Example of certificate awarded upon successful completion of the course.

*upon successful completion

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Learning Objectives

  1. Recognize the initial PCBA processes, such as incoming inspection and laser marking.
  2. Describe the importance of the solder paste printing process and Solder Paste Inspection (SPI).
  3. Identify the component placement process and the different types of placement machines.
  4. Explain the process of reflow soldering and the subsequent Automated Optical Inspection (AOI).
  5. Understand the processes involved in final assembly and testing, such as In-Circuit-Testing (ICT), depaneling, functional testing, enclosure assembly, and final testing.
An illustration of a pick-and-place machine placing components on a PCB to create a Printed Circuit Board Assembly (PCBA).
Printed Circuit Board Assembly (PCBA) Course

Table of Contents

  1. PCBA Processes
    1. Incoming Inspection
    2. Laser Marking
      1. Laser Marking System
      2. Laser Marking Location
    3. Solder Paste Printing
      1. Solder Paste Printing Process
      2. Solder Paste Inspection (SPI)
        1. In-Line Automated Inspection
        2. Other Methods
    4. Component Placement
      1. Component Placement Process
      2. Pick-and-Place Machine
    5. Reflow Soldering
      1. Reflow Oven
      2. Temperature Zones
        1. Preheat Zone
        2. Soak Zone
        3. Reflow Zone
        4. Cooling Zone
    6. Automated Optical Inspection (AOI)
      1. Automated Optical Inspection (AOI) Process
      2. Automated X-Ray Inspection (AXI) Process
  2. Final Assembly and Testing
    1. In-Circuit Testing (ICT)
      1.   ICT Equipment
      2.   Key Parameters
    2. Depaneling
      1. Routing
      2. Sawing
      3. V-Cut
      4. Laser Separation
    3. Functional Testing
    4. Enclosure Assembly
    5. Final Testing

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