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A semiconductor metrology instrument that employs atomic force microscopy to analyze the wafer using a laser, cantilever, and photodetector.

Semiconductor Metrology Instruments

The THORS Semiconductor Metrology Instruments course is designed to provide learners with a comprehensive understanding of semiconductor metrology instruments from wafer inspection systems to different process control metrology instruments. Ready to take the next step? Explore the course details and see everything we’ve packed into this program!

Learning Hours: 2

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Course Description

The THORS Semiconductor Metrology Instruments course introduces the learners to the various instruments used in semiconductor testing. This course focuses on wafer inspection systems, which are used for identifying defects, and process control metrology instruments, which are used for measuring various aspects of semiconductor manufacturing processes. Presented in THORS’ highly visual and interactive learning format, this course will equip the learner with a foundational knowledge of semiconductor metrology.

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Who will benefit from this semiconductor metrology instruments course?

Quality, manufacturing, engineering, design, testing, purchasing, and sales functions at organizations that require a comprehensive understanding of the instruments and techniques involved in semiconductor metrology from wafer inspection systems to process control metrology.

 

THORS uses Bloom’s Taxonomy Methodology for our course development

Certificate Awarded for Semiconductor Metrology Instruments

Example of certificate awarded upon successful completion of the course.

*upon successful completion

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Learning Objectives

  1. Identify the different wafer inspection systems and their optical and charged particle sources.
  2. Recognize some of the commonly used instruments in destructive techniques and their applications.
  3. Recognize some of the commonly used instruments in nondestructive techniques and their applications.
  4. Describe the instruments and techniques used in process control metrology for the different deposited films and intricate pattern designs.
  5. Explain the measurement techniques used for topography and physical dimension measurement.
  6. Distinguish between the various techniques for analyzing material composition.
  7. Understand the instruments used in material property measurements.
An illustration showing the key components of a Scanning Electron Microscope (SEM), which is a semiconductor metrology instrument, that is used to inspect a wafer using an electron beam.
Semiconductor Metrology Instruments THORS course image

Table of Contents

  1. Wafer Inspection System
    1. Destructive Techniques
      1. Electron Beam
        1. Electron Beam Inspection System
        2. Scanning Electron Microscope (SEM)
      2. Focused Ion Beam (FIB) Inspection System
    2. Nondestructive Techniques
      1. Plasma Inspection System
      2. Deep Ultraviolet (DUV) Inspection System
      3. Laser Scanning Inspection System
      4. X-Ray Inspection System
      5. Automated Optical Inspection (AOI) System
  2. Process Control Metrology
    1. Topography and Physical Dimension
      1. Optical Profilometry
      2. Interferometry
      3. Ellipsometry
      4. Spectroscopic Reflectometry
      5. Scatterometry
      6. Atomic Force Microscopy (AFM)
      7. Optoacoustic Imaging
    2. Material Composition
      1. X-Ray Photoelectron Spectroscopy (XPS)
      2. X-Ray Diffraction (XRD)
      3. Auger Electron Spectroscopy (AES)
      4. Secondary Ion Mass Spectroscopy (SIMS)
      5. Rutherford Backscattering Spectroscopy (RBS)
      6. Fourier Transform Infrared (FTIR)
    3. Material Property
      1. Four-Point Probe System
      2. Resistivity Mapping System

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