The Cz process in semiconductor manufacturing shows a seed crystal being pulled and an ingot emerging in the crucible.

Semiconductor Manufacturing I

Semiconductor manufacturing is a complex process involving many steps. The THORS Semiconductor Manufacturing I course covers two crucial steps in the manufacturing process: silicon wafer fabrication and semiconductor deposition. Ready to take the next step? Explore the course details and see everything we’ve packed into this program!

Learning Hours: 2

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Course Description

Semiconductor manufacturing is a complex process involving many steps. The THORS Semiconductor Manufacturing I course covers two crucial steps in the manufacturing process: silicon wafer fabrication and semiconductor deposition. The silicon wafer fabrication step encompasses single crystal silicon growth, wafer grinding, wafer slicing, wafer edge grinding, wafer lapping, wafer etching, and wafer polishing. The semiconductor deposition step includes various important types of deposition processes in semiconductor manufacturing. To enhance the learning experience, the course contains interactive quizzes, allowing learners to test their knowledge and retention of visually engaging content.

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Who will benefit from this semiconductor manufacturing course?

Quality, manufacturing, engineering, design, testing, purchasing, and sales functions at organizations that require an understanding of how semiconductor devices are manufactured.

THORS uses Bloom’s Taxonomy Methodology for our course development

Certificate Awarded for Semiconductor Manufacturing I

Example of certificate awarded upon successful completion of the course.

*upon successful completion

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Learning Objectives

  1. Describe the various steps involved in the fabrication of silicon wafers, including crystal growth, slicing, lapping, etching, and polishing.
  2. Recognize the types of epitaxy and the process involved in creating them.
  3. Identify the different types of deposition processes used to create thin films and patterns on silicon wafers, and the applications of each method.
  4. Explain the basic principles of the different types of deposition processes, such as CVD, PVD, ALD, ECD, and SOD.
A sputter deposition chamber showing the process of deposition used in semiconductor manufacturing.
Semiconductor Manufacturing I

Table of Contents

  1. Silicon Wafer Fabrication Process
    1. Single Crystal Silicon Growth
    2. Wafer Grinding
    3. Wafer Slicing
    4. Wafer Edge Grinding
    5. Wafer Lapping
    6. Wafer Etching
    7. Wafer Polishing
  2. Semiconductor Deposition
    1. Epitaxy
      1. Types
      2. Process
    2. Deposition
      1. Chemical Vapor Deposition (CVD)
        1. Thermal CVD
        2. Plasma CVD
          1. Plasma Enhanced Chemical Vapor Deposition (PECVD)
          2. High Density Plasma Chemical Vapor Deposition (HDPCVD)
      2. Atomic Layer Deposition (ALD)
        1. Process
        2. Types
        3. Application
      3. Physical Vapor Deposition (PVD)
        1. Process
        2. Other Sputter Depositions
        3. Application
      4. Electrochemical Deposition (ECD)
        1. Process
        2. Application
      5. Spin-On Dielectric (SOD)

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