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Open circuit, short circuit, contamination, and bite defects are identified on a patterned wafer during semiconductor metrology.

Semiconductor Metrology Basics

$140.00

The THORS Semiconductor Metrology Basics is designed to provide learners with a comprehensive understanding of semiconductor metrology through defect inspection, defect characterization, and defect review as well as the key parameters that are measured to control different semiconductor manufacturing processes.
Learning Hours: 1.5

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Course Description

The THORS Semiconductor Metrology Basics course introduces the learners to the significance of testing in semiconductor manufacturing. This course focuses on key measurements in semiconductor metrology for defect inspection and process control. Presented in THORS’ highly visual and interactive learning format, this course will equip the learner with a foundational knowledge of semiconductor metrology.

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Who will benefit from this semiconductor metrology course?

Quality, manufacturing, engineering, design, testing, purchasing, and sales functions at organizations that require a comprehensive understanding of the processes involved in semiconductor metrology from defect inspection to semiconductor manufacturing process metrology.

THORS uses Bloom’s Taxonomy Methodology for our course development

Certificate Awarded for Semiconductor Metrology Basics

Example of certificate awarded upon successful completion of the course.

*upon successful completion

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Learning Objectives

  1. Recognize the significance of metrology in semiconductor manufacturing.
  2. Identify the types and causes of defects.
  3. Classify defects based on the pattern of their occurrence on a wafer.
  4. Recognize the methods used for defect review.
  5. Explain the key parameters required to characterize and control semiconductor manufacturing processes.
A semiconductor wafer with fewer defects, which is detected through semiconductor metrology, shows an increase in chip yield.
Semiconductor Metrology Basics THORS course image

Table of Contents

  1. Defect Inspection
    1. Defect Identification
      1. Types of Defects
      2. Causes of Defects
        1. Errors in Manufacturing Processes
        2. Presence of Particles
    2. Defect Characterization
    3. Defect Review
      1. Traditional Methods
      2. Deep Learning
  2. Process Characterization
    1. Deposited Film Characterization
    2. Metalized Film Characterization
    3. Photolithography Characterization
      1. Photoresist Thickness
      2. Pattern Dimension
      3. Alignment
    4. Etch Characterization
      1. Critical Dimension (CD)
      2. Etch Rate
      3. Etch Selectivity
    5. Chemical Mechanical Polishing (CMP) Characterization
    6. Ion Implantation Characterization
      1. Ion Implant Does and Depth
      2. Ion Implant and Anneal Uniformity
      3. Sheet Resistance
      4. Doping Concentration

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